Joyce, from a connector maker's view point, nickel is absolutely needed for a reliable separable interface. It prevents Cu migration through the gold which will happen if there is no Ni barrier.
Jim McGrath
Strategic Marketing Manager
TE Consumer Devices
Cell: 630-244-3872
Email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, October 23, 2012 10:36 AM
To: [log in to unmask]
Subject: Re: [TN] Ni barrier thickness - Part II
Cu form oxide and easy to be corroded. Not suitable as contact surface. As a contact surface, hard gold is suitable choice. Ni barrier layer is not necessary if your gold plating has good quality (pore free electrolytic) and sufficient thickness ($). My 2 cents.
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----- Original Message -----
From: Ioan Tempea [mailto:[log in to unmask]]
Sent: Tuesday, October 23, 2012 08:41 AM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] Ni barrier thickness - Part II
Dear Technos,
I guess you had all already guessed where I'm trying to get at: I have Cu diffusion at the surface of the Au on some connecting pins and can't assess the effect on long term reliability.
So here comes the second question: are there any studies / rules of thumb that could say how much of the Au surface may be lost without any negative impact on the functionality? I definitely got the message that everything is application related, but just trying my luck...
Or, anybody has an idea how could I test the long term reliability in this situation?
Thanks,
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/>
950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
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[signature001] <http://www.facebook.com/pages/Digico/277076778479>
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Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain
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