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Date: | Tue, 23 Oct 2012 12:41:16 +0000 |
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Dear Technos,
I guess you had all already guessed where I'm trying to get at: I have Cu diffusion at the surface of the Au on some connecting pins and can't assess the effect on long term reliability.
So here comes the second question: are there any studies / rules of thumb that could say how much of the Au surface may be lost without any negative impact on the functionality? I definitely got the message that everything is application related, but just trying my luck...
Or, anybody has an idea how could I test the long term reliability in this situation?
Thanks,
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
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T+ 1 (450) 967-7100, EXT244
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Entreprise manufacturière / Gestion du capital humain
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