Hi Tom-

Why would you want to do this?

This is important in providing an answer:  If the quantity to be processed is large, then an automated process can be developed.  On the other hand, if the quantity is one, then the spheres can be hand placed in tacky flux.  An order of 0.2mm solder spheres is not cheap (approximately $1000US), so I hope the product is worth it!

I have good experiences working with PacTechUSA to ball stuff this size using their laser placement system.  Developing the programming/profile will be several thousand dollars.

If the solder pads are all exactly the same size on the board they are being placed on, then removing the present spheres from the part and placing the parts on the board after the solder paste reflows would probably work, but you will have to tinker with the deposits a lot to get the right size and shape.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Subscribe TechNet Tom Granat
Sent: Wednesday, October 17, 2012 11:30 AM
To: [log in to unmask]
Subject: [TN] NanoFree die size BGA reballing

Has anyone had any succes trying to reball a TI NanoFree BGA? This technology applies the ball directly to the surface of the die

________________________________

Email addresses of ITT Exelis employees have changed from itt.com to exelisinc.com. Please update your favorites and contact information to reflect these changes.

This e-mail and any files transmitted with it may be proprietary and are intended solely for the use of the individual or entity to whom they are addressed. If you have received this e-mail in error please notify the sender. Please note that any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Exelis Inc. The recipient should check this e-mail and any attachments for the presence of viruses. Exelis Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________