Some packages contain items that have sharp corners. 

PCBs and ICs are not like potato chips.

Bob K.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Monday, October 15, 2012 1:42 PM
To: [log in to unmask]
Subject: Re: [TN] Air Pressures Changes During Overnight Shipping

If your package as good as a bag of potato chips, no problem. If your
package can not withstand cabinet pressure change, something is wrong with
your package. We are not talking about rapid decompression as in case of
bullet holes. (In that case, you got other more important stuff to worry
about than potato chips:-)
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Robert Kondner [mailto:[log in to unmask]]
Sent: Monday, October 15, 2012 01:30 PM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] Air Pressures Changes During Overnight Shipping

Hi,

 

I was wondering if anyone knows about changes in air pressure as experienced
by overnight shipping of components.

 

High altitude air is fairly dry but a leaking package would re-inflate
somewhat on landing sucking in ground level air.

 

This all might amount to a pile of hogwash but I was curious if it had ever
been explored.

 

Bob K.



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