TECHNET Archives

October 2012

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset="us-ascii"
X-To:
Technet <[log in to unmask]>
Date:
Tue, 23 Oct 2012 18:00:43 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Kris Roberson <[log in to unmask]>
Subject:
FW: IPC-SM-817 Revision Second request
From:
Kris Roberson <[log in to unmask]>
Message-ID:
<[log in to unmask]>
MIME-Version:
1.0
Content-Transfer-Encoding:
quoted-printable
Sender:
TechNet <[log in to unmask]>
Parts/Attachments:
text/plain (15 lines) 
Hello Technetters,

The IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives was last reviewed by committee in 1989. Recently there have been emails sent to me expressing interest in the revision of the IPC-SM-817.

If you would like to participate in the revision of this standard, please let me know by email at [log in to unmask]<mailto:[log in to unmask]>.

Thank you for your participation!

Mr. Kris Roberson
IPC- Association Connecting Electronics Industries(r) Manager, Assembly Technology [log in to unmask]
Phone: 847-597-2846
Fax: 847-615-5646
www.ipc.org
[Description: Description: ipc]

ATOM RSS1 RSS2