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October 2012

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TechNet <[log in to unmask]>
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Date:
Wed, 10 Oct 2012 21:59:10 -0600
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TechNet E-Mail Forum <[log in to unmask]>, "Woolley, Mark D. (Mark)" <[log in to unmask]>
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Subject:
Glob Top removal
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"Woolley, Mark D. (Mark)" <[log in to unmask]>
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"Shaffer, Larry J (Larry)" <[log in to unmask]>
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Does anyone know of a way to remove the epoxy that is used to cover CoB
ICs, while maintaining the integrity of the PWB-CoB Assembly afterwards?
I have tried hot Nitric Acid, which does remove the epoxy nicely, but
also removed the copper on the PWB and swelled during the decap process
and ruptured the bondwires.  I believe Red Fuming Nitric would also
swell the epoxy lifting the bondwires.  Most aggressive solvents don't
remove epoxies well. So I am pout of ideas at present.

Thanks,
mark

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