If the plate shop maintains good chemistry - 3 to 4 microns nickel and 0.5
microns hard gold should pass most requirements except space/ military.
But like Jk says good chemistry and well maintained baths.
Anil
-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]]
Sent: 23 October 2012 22:47
Subject: Re: Ni barrier thickness - Part II
I got a question: how many of the contact plating house still plate hard
gold? I mean follow the actual formulation and plating condition, with
proper Ni or Co hardening co-plated, rather than only make sure minimum gold
content is met (others are what ever the junk in the tank). I believe there
are fair amount of stuff out there are not real "hard gold", although they
met the hardness and gold%.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Joyce Koo [mailto:[log in to unmask]]
Sent: Tuesday, October 23, 2012 11:56 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Ni barrier thickness - Part II
Agree. Especially when you try to limit gold plating thickness. However,
there are connectors used in the past with very thick pore free electrolytic
gold with good reliability (pass gel test for pore and tested at 450 C bake
for 30 min. Using same plating condition ceramic coupon. Test surface oxide
composition and thickness using dynamic SIMS).
--------------------------
Sent using BlackBerry
----- Original Message -----
From: McGrath, Jim [mailto:[log in to unmask]]
Sent: Tuesday, October 23, 2012 11:48 AM
To: TechNet E-Mail Forum <[log in to unmask]>; Joyce Koo
Subject: RE: [TN] Ni barrier thickness - Part II
Joyce, from a connector maker's view point, nickel is absolutely needed for
a reliable separable interface. It prevents Cu migration through the gold
which will happen if there is no Ni barrier.
Jim McGrath
Strategic Marketing Manager
TE Consumer Devices
Cell: 630-244-3872
Email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, October 23, 2012 10:36 AM
To: [log in to unmask]
Subject: Re: [TN] Ni barrier thickness - Part II
Cu form oxide and easy to be corroded. Not suitable as contact surface. As
a contact surface, hard gold is suitable choice. Ni barrier layer is not
necessary if your gold plating has good quality (pore free electrolytic) and
sufficient thickness ($). My 2 cents.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Ioan Tempea [mailto:[log in to unmask]]
Sent: Tuesday, October 23, 2012 08:41 AM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] Ni barrier thickness - Part II
Dear Technos,
I guess you had all already guessed where I'm trying to get at: I have Cu
diffusion at the surface of the Au on some connecting pins and can't assess
the effect on long term reliability.
So here comes the second question: are there any studies / rules of thumb
that could say how much of the Au surface may be lost without any negative
impact on the functionality? I definitely got the message that everything is
application related, but just trying my luck...
Or, anybody has an idea how could I test the long term reliability in this
situation?
Thanks,
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>
950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
[signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain
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