Hard to find fabricators who will do the first!  Whenever I ask, they always say that if they fill/plug then they will plate over so that they have a single process to follow.  A shame since that plating cycle costs a lot and can be responsible for reduced resolution on the outer layers.  Most designs I see can live without the overplate (such as vias under a QFN center pad) but the plated-over ones look prettier so I guess that's why it has the market share.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Thursday, September 20, 2012 2:59 PM
To: [log in to unmask]
Subject: Re: [TN] ] Broken Vias

Potentially, neither. Either plug with an approved material (not CB100) and tent with LPISM or fill (plug) and plate-over and then tent with a LPISM unless access is needed (via-in-pad, test point, etc.) Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: Thursday, September 20, 2012 11:46 AM
To: [log in to unmask]
Subject: [TN] ] Broken Vias

Vias @ 12mils diameter
Tented with LPI (Screened and have possible broken tents) or cleared vias solder coated ? Which process is most robust?

Thank you, Jim Mahoney
Mass Design Inc.
Applications Engineer
P# 603-886-6460 X215
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