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Date: | Thu, 20 Sep 2012 18:58:41 +0000 |
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Potentially, neither. Either plug with an approved material (not CB100) and tent with LPISM or fill (plug) and plate-over and then tent with a LPISM unless access is needed (via-in-pad, test point, etc.)
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: Thursday, September 20, 2012 11:46 AM
To: [log in to unmask]
Subject: [TN] ] Broken Vias
Vias @ 12mils diameter
Tented with LPI (Screened and have possible broken tents) or cleared vias solder coated
? Which process is most robust?
Thank you, Jim Mahoney
Mass Design Inc.
Applications Engineer
P# 603-886-6460 X215
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