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September 2012

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Sep 2012 01:24:55 -0500
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Hi Bob - I don't know the fill  material but the 370HR laminate is widely 
used in lead-free processes. It was our test vehicle laminate in the 
JCAA/JGPP and NASA DoD Lead-free consortium and had good performance.

Dave Hillman
Rockwell Collins
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Robert Kondner <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/18/2012 07:37 PM
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Subject
[TN] Broken Vias






Hi,

 

This is a follow up on the broken vias on a board with plugged and plated
through vias.

 

The laminate is 370HR (Tg 180) and the fill material is  PHP-900 IR-6P 
from
San-Ei Kagaku (Tg 168).

 

I do not have cross section pictures yet.

 

If anyone has any ideas on how these material might react to a lead free
reflow process and via barrels would be broken please let me know. I am
interested in any and all ideas.

 

Bob K.



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