Hi,

 

This is a follow up on the broken vias on a board with plugged and plated
through vias.

 

The laminate is 370HR (Tg 180) and the fill material is  PHP-900 IR-6P from
San-Ei Kagaku (Tg 168).

 

I do not have cross section pictures yet.

 

If anyone has any ideas on how these material might react to a lead free
reflow process and via barrels would be broken please let me know. I am
interested in any and all ideas.

 

Bob K.



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