start with x-section to see what basic failure mode is and look for 
latent mfg defects first.

At 10:02 AM 9/17/2012, Julie Silk wrote:
>Where's Paul Reid?  He made a comment in a seminar that he sees a 
>higher failure rate for filled/plated over vias than for open 
>ones.  I agree that your exact fill material and characteristics are 
>needed.  While this process is well-known, the fill and the wrap are 
>significant variables.  Good selection for the fill, good process 
>control for the wrap.  And look at what heat has been applied.  Any 
>rework?  For these parts or nearby?


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________