Test data from board house net to net node to node
Coupons of copper thickness from board house
Reflow profile that the boards went through and how/where it was measured

Etc Etc
John Burke

General Manager/COO

Zollner Electronics Inc
Plant Milpitas
575 Cottonwood Drive
Milpitas, CA 95035
Phone:          + 1 408 434 5442
Fax:            + 1 408 434 5401
Mobile:         + 1 408 628 2433
E-mail:         [log in to unmask]
Internet:  www.zollner-electronics.com



From:   Robert Kondner <[log in to unmask]>
To:     <[log in to unmask]>
Date:   09/14/2012 08:21 AM
Subject:        [TN] Broken Vias
Sent by:        TechNet <[log in to unmask]>



Hi,

 

A small company in the area has a board with two very expensive parts, 
about
$3K each part. They built 30 boards and had lots of open via connections.
They are getting cross sections now on some bad vias. In addition to many
bad vias there was some board warp. Sorry I don't have any hard numbers on
bad via counts or warp.

 

These were 10 mil holes in .062 material, a 6:1 aspect ratio, should be
easy. Vias were plugged and plated so they could be used as flying probe
test points. 

 

After reflow assembly the boards were run on a wave machine using a mask
where about 25% of the board was exposed to the wave. Everything lead 
free. 

 

Question:

 

Can folks suggest lists of items we can check, measure or inquire into? 
Any
guesses or ideas as what might be going on?

 

Thanks,

Bob K.



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