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September 2012

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Subject:
Peel strength requirements for heatsink adhesion
From:
Pradeep Menon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Pradeep Menon <[log in to unmask]>
Date:
Fri, 14 Sep 2012 04:30:29 +0000
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Is anybody aware of any specified requirements for peel strength of thermal plate heat-sink from a printed wiring board in a thermal bonded pcb. Any test method? We were unable to locate any IPC specification / test method for the same

Rgds

Pradeep

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