Hi Experts,

Please pardon my ignorance, as I am a PCB designer trying to learn more 
about the PCB fabrication process.

We are planning to use Immersion Silver with OSP for a limited number of 
high-speed traces.  Solder Mask will not be applied to these areas.  My 
question is: does ImAg + OSP replace HASL process.  If yes then does it 
mean we can not have ImAg + OSP for only part of the board, but it has to 
be applied to the full board.

Thanks for your help.



Regards
Ravinder Ajmani
HGST, a Western Digital company
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