I would start by looking at the spec for the part as some high power LEDs have a tight requirement on their heatsink requirements.
The IPC spec comes after the component spec if the component spec demands more area of connection (lack of voids) than IPC.
Rex

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Juliano Ribeiro
Sent: 10 September 2012 13:12
To: [log in to unmask]
Subject: [TN] LED Ilumination Voids

Hi to all,
We have IPC (e.g.:7095) for BGA and voids percent not allowed. But for LED Ilumination, is there rule (IPC documentation)? We can use the same criteria for BGA, in the void case?
We are soldering LED and when we inspected with X-Ray, the quantity voids in the soldering is elevated so we didn´t know define the ok percent.

Thank you

Juliano Ribeiro
Coordenador de Produção - Placas Eletrônicas Elo Sistemas Eletrônicos S.A.
Fone: (51) 2131 2217    Fax: (51) 2131 2200
Cel: (51) 9356 2844                                                                                                                                                                 

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