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September 2012

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Subject:
From:
"Post, Scott E" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Post, Scott E
Date:
Thu, 27 Sep 2012 18:30:36 +0000
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text/plain
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That was my thought as well.  I've learned to reflow SIR coupons at the low end of the reflow profile window when testing new pastes.

Scott Post
P.O.U. 0000-001E-0CTC
2151 E. Lincoln Road
Kokomo, Indiana    46904-9005
765-451-2983 (Phone)
765-451-0287 (FAX)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Tellefsen
Sent: Thursday, September 27, 2012 2:14 PM
To: [log in to unmask]
Subject: Re: [TN] Flux Activation Temps

I'd be more concerned about SIR than lack of reflow.  The concept of
activation is misleading.

Karen Tellefsen - Electrical Testing
Alpha / 109 Corporate Blvd./ S. Plainfield, NJ 07080
[log in to unmask]
908-791-3069




From:   Robert Kondner <[log in to unmask]>
To:     <[log in to unmask]>,
Date:   09/27/2012 01:13 PM
Subject:        [TN] Flux Activation Temps
Sent by:        TechNet <[log in to unmask]>



Hi,



I was looking though some paste datasheets which show a paste "Family"
available in different alloys.



My Question:



Is a single flux formulation being used with these different alloys? It
seems so.



But the various melting point have a serious range. And I remember from my
college chemistry days that reaction rates double for every 10 C rise in
temp. (Is that still correct?) So I would expect fluxes to be relatively
"Inactive" al low leaded temps but then going super-fast at higher lead
free
temps.



Can anyone clarify? Is it a real issue or hogwash-worthy.



Thanks,

Bob K.







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