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September 2012

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Subject:
From:
Karen Tellefsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karen Tellefsen <[log in to unmask]>
Date:
Thu, 27 Sep 2012 14:13:38 -0400
Content-Type:
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I'd be more concerned about SIR than lack of reflow.  The concept of 
activation is misleading. 

Karen Tellefsen - Electrical Testing
Alpha / 109 Corporate Blvd./ S. Plainfield, NJ 07080
[log in to unmask]
908-791-3069




From:   Robert Kondner <[log in to unmask]>
To:     <[log in to unmask]>, 
Date:   09/27/2012 01:13 PM
Subject:        [TN] Flux Activation Temps
Sent by:        TechNet <[log in to unmask]>



Hi,

 

I was looking though some paste datasheets which show a paste "Family"
available in different alloys. 

 

My Question:

 

Is a single flux formulation being used with these different alloys? It
seems so.

 

But the various melting point have a serious range. And I remember from my
college chemistry days that reaction rates double for every 10 C rise in
temp. (Is that still correct?) So I would expect fluxes to be relatively
"Inactive" al low leaded temps but then going super-fast at higher lead 
free
temps.

 

Can anyone clarify? Is it a real issue or hogwash-worthy.

 

Thanks,

Bob K.

 

 



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