The mixed solder discussion here on TechNet prompts me to share my current problem:

I have been been chartered with providing specific examples of product failures during implementation of Pb-free electronics. This will be helpful to industries faciing RoHS 2 requirements, or expecting to fall under future RoHS requirements.   Hopefully, these will come from the last couple of years, and can include examples of:

Mixed solder joint failures before normal expected product life
Pad cratering failures found on product analysis - not from planned failure studies, but from operational products
Tin whiskers failures - hopefully beyond those already on NASA web page, and more recent than many of those
Component failures due to greatly increased assembly temperatures using up expected component life
Field failures due to Pb-free circuit boards - creep corrosion, solder mask interfacial attack, etc. 
Failures due to poor engineering understanding of Pb-free solder properties - yes, I know about the X-box problem.

As necessary, please respond off line to me by deleting the [log in to unmask] address when you hit the "reply to all" button on this message.  

Thanks in advance - Denny Fritz



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________