TECHNET Archives

September 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 26 Sep 2012 11:35:11 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
It depends on their capability to control the reflow profile. If they can control the TAST such that they can solder to the lead-free solder balls without having any of them go into liquidus, then it may be able to be done.
Are you sure they are not speaking of Pb90 solder balls? It is a common practice to use Sn63 to solder to Pb90.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Tuesday, September 25, 2012 7:26 PM
To: [log in to unmask]
Subject: [TN] Leaded Paste and Lead Free BGAs - Do they mix?

Hi,

 

I have a customer using leaded paste with lead free BGAs. I think they want to have the balls NOT collapse for better optical inspection.

 

Sounds like a really bad idea to me but I have no explanation where I can say as why.

 

Can anyone make suggestions either way?

 

Thanks,

Bob K.



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2