Richard,

"What I was especially amazed by was the amount of water a silicon chip will
absorb. You would not think a piece of glass could add 10% of its dry total
weight in water less than 8 hours later in a 40%RH atmosphere."

I had not experienced that in the past.  When baking hybrids, it was always
observed that adhesives and platings were the major moisture absorbers.
Alumina, Silicon, and wires were deemed as surface adsorbers as moisture
would flash off quickly under temp or vacuum.

I can readily understand how the surface of the chip will adsorb moisture,
but die attach adhesives also are EXCEPTIONAL moisture absorbers as are most
molding compounds, if speaking of PEMs.

Were you speaking of bare silicon chips & wafers?
Or chip on board products, or packaged die?

Reach way back into your databanks...  :-)

Steve C


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