Wayne,

Actually it is easier to fill vias w/o cap plating....specially if they are not Blind vias.

We did this on a large number of brds manu(>100). for Curiosity/MSL (JPL).

Rush
www.Accueng.com
818-768-3919

 

 

 

-----Original Message-----
From: Thayer, Wayne - IS <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Thu, Sep 20, 2012 2:03 pm
Subject: Re: [TN] ] Broken Vias


Hard to find fabricators who will do the first!  Whenever I ask, they always say 
that if they fill/plug then they will plate over so that they have a single 
process to follow.  A shame since that plating cycle costs a lot and can be 
responsible for reduced resolution on the outer layers.  Most designs I see can 
live without the overplate (such as vias under a QFN center pad) but the 
plated-over ones look prettier so I guess that's why it has the market share.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Thursday, September 20, 2012 2:59 PM
To: [log in to unmask]
Subject: Re: [TN] ] Broken Vias

Potentially, neither. Either plug with an approved material (not CB100) and tent 
with LPISM or fill (plug) and plate-over and then tent with a LPISM unless 
access is needed (via-in-pad, test point, etc.) Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: Thursday, September 20, 2012 11:46 AM
To: [log in to unmask]
Subject: [TN] ] Broken Vias

Vias @ 12mils diameter
Tented with LPI (Screened and have possible broken tents) or cleared vias solder 
coated ? Which process is most robust?

Thank you, Jim Mahoney
Mass Design Inc.
Applications Engineer
P# 603-886-6460 X215
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