Hi,
This is a follow up on the broken vias on a board with plugged and plated
through vias.
The laminate is 370HR (Tg 180) and the fill material is PHP-900 IR-6P from
San-Ei Kagaku (Tg 168).
I do not have cross section pictures yet.
If anyone has any ideas on how these material might react to a lead free
reflow process and via barrels would be broken please let me know. I am
interested in any and all ideas.
Bob K.
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