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Date: | Wed, 26 Sep 2012 11:33:41 +0000 |
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Bob,
Not only is it a bad idea based on the reduced reliability of the solder joint, it's also practically infeasible. As soon as the SnPb solder paste melts, it will start incorporating the Pb-free ball into the melt, so regardless of the reflow profile, there will be some, if not complete 'collapse' of the Pb-free ball.
Ben
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Tuesday, September 25, 2012 8:26 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Leaded Paste and Lead Free BGAs - Do they mix?
Hi,
I have a customer using leaded paste with lead free BGAs. I think they want to have the balls NOT collapse for better optical inspection.
Sounds like a really bad idea to me but I have no explanation where I can say as why.
Can anyone make suggestions either way?
Thanks,
Bob K.
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