Hi,

 

Can anyone point me to a document that describes how moisture can be driven
out of internal PCB layers if solid copper layers exist above and below
internal layers?

 

When routing PCB connections to internal layers, say GND for example, you
want to tie together multiple GND plane layers. But unless a thermal
connection is provided I see no way for moisture to escape from internal
layers.

 

Using thermal vias breaks up GND planes so it is common to flood vias. 

 

Question:

 

  Do flooded vias to multiple layers raise problems with bake out?

 

Bob K



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