Hi Kevin - I would not recommend using hard gold as a alternative to ENIG. 
 Depending on the elemental additive used in hard gold, you will have 
soldering issues. Also, electroplated gold (aka hard gold) and ENIG 
operate using different deposition processes. Hard gold typically is very 
porous when thin  which can result in solderability issues. Hard gold is 
typically intended for connection applications and not soldering 
applications.

Dave



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[TN] PCB finish: ENIG vs. hard gold






Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG 
finish, due to PCB size and processing capabilities.  The application is 
Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/ 
Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or 
their suitability?  Is there an IPC spec (or specs) that outline "hard 
gold"?

Thanks,

Kevin Glidden


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