I would suggest 4-8 uinches.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 14, 2012 3:40 PM
To: [log in to unmask]
Subject: Re: [TN] PCB finish: ENIG vs. hard gold
If you go for what ever the gold, keep it thin (8-10 micro inches). Save your money and headache.
Joyce Koo
Materials Researcher - Materials Interconnect Lab Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chuck Brummer
Sent: Tuesday, August 14, 2012 4:30 PM
To: [log in to unmask]
Subject: Re: [TN] PCB finish: ENIG vs. hard gold
Kevin,
Make sure you require a Ni barrier layer between the copper and gold (hard of soft)!
Chuck
Charles W. Brummer | 3M Manufacturing Engineer 3M Electronic Solutions Division 3M Canoga Park, 8357 Canoga Ave. | Canoga Park, CA 91304
Office: 818 734 4930
[log in to unmask] | www.3M.com
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From: "Glidden, Kevin" <[log in to unmask]>
To: <[log in to unmask]>
Date: 08/14/2012 09:15 AM
Subject: [TN] PCB finish: ENIG vs. hard gold
Sent by: TechNet <[log in to unmask]>
Hi everyone,
We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities. The application is Class 3 (mil/aero). The circuit is thin FR4 and subject to SMT reflow w/
Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.
Can anyone offer info on the differences between the two finishes, and/or their suitability? Is there an IPC spec (or specs) that outline "hard gold"?
Thanks,
Kevin Glidden
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