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August 2012

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Subject:
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 14 Aug 2012 13:30:27 -0700
Content-Type:
text/plain
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text/plain (59 lines)
Kevin,

Make sure you require a Ni barrier layer between the copper and gold (hard 
of soft)!

Chuck


Charles W. Brummer | 3M Manufacturing Engineer
3M Electronic Solutions Division
3M Canoga Park, 8357 Canoga Ave. | Canoga Park, CA 91304
Office: 818 734 4930
[log in to unmask] | www.3M.com


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From:   "Glidden, Kevin" <[log in to unmask]>
To:     <[log in to unmask]>
Date:   08/14/2012 09:15 AM
Subject:        [TN] PCB finish: ENIG vs. hard gold
Sent by:        TechNet <[log in to unmask]>



Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG 
finish, due to PCB size and processing capabilities.  The application is 
Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/ 
Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or 
their suitability?  Is there an IPC spec (or specs) that outline "hard 
gold"?

Thanks,

Kevin Glidden


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