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August 2012

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 14 Aug 2012 18:42:48 +0000
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That make sense.  The vendor might intend to say is gold flash.  Not the hard gold as we call it: Ni or Co hardening one for edge connector (or plating tank got a lot of junk co plated both Cu and Au at high speed).  

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Tuesday, August 14, 2012 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] PCB finish: ENIG vs. hard gold

I am not sure I can talk to hard or soft gold, and suitability for
soldering. 
But, I can say that it is possible to solder to electroplated gold, which is
different from Immersion Gold finish. 
I think some people say hard gold when they mean electroplated gold. 
There is a brief discussion of this in Coomb's Handbook.
Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, August 14, 2012 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB finish: ENIG vs. hard gold

Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG
finish, due to PCB size and processing capabilities.  The application is
Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/
Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or
their suitability?  Is there an IPC spec (or specs) that outline "hard
gold"?

Thanks,

Kevin Glidden


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