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August 2012

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 14 Aug 2012 16:20:13 +0000
Content-Type:
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Not solderable. 

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, August 14, 2012 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB finish: ENIG vs. hard gold

Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities.  The application is Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or their suitability?  Is there an IPC spec (or specs) that outline "hard gold"?

Thanks,

Kevin Glidden


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