Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities.  The application is Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or their suitability?  Is there an IPC spec (or specs) that outline "hard gold"?

Thanks,

Kevin Glidden


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