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August 2012

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 14 Aug 2012 10:29:06 +0000
Content-Type:
text/plain
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Yes and no.  You can calculate intermetallic growth rate at room t vs -40 c for solder joints or Hasl finish.  However, for plasic, extremely low t may not prolong life.  All depend on what you put it on pcba.  Ask your design group for direction.   If you. Are from design, I rest my case.  
--------------------------
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----- Original Message -----
From: Ivan Feng [mailto:[log in to unmask]]
Sent: Tuesday, August 14, 2012 06:19 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] PCBA shelf life

Thanks  for all your inputs. Yes it depends, but is there any data or applicable models to model the relation of PCBA shelf life vs. its storage condition. Or any approach to determine shelf life under a given environment.

Thanks

From: Reuven Rokah [mailto:[log in to unmask]]
Sent: 2012Äê8ÔÂ14ÈÕ 13:47
To: TechNet E-Mail Forum; Feng, Ivan(·ëÑ©)
Subject: Re: [TN] PCBA shelf life

Ivan,
Its depend on : storage condition, packaging type, working (yes/no), environment (if at work) etc.
On Tue, Aug 14, 2012 at 4:21 AM, Ivan Feng <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Folks,

Bare PCB has a shelf life depending on its surface finish, component like electrolytic capacitor and MSD devices also have defined shelf life.
But for PCBA, how to define its shelf life? Is there any applicable standards?

Any suggestions are welcomed.

Regards
Ivan

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