Choose connectors/components with a standoff will help a lot.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Friday, 10 August 2012 4:10 AM
To: [log in to unmask]
Subject: Re: [TN] pin in paste

You can be sure



Regards

Mike 


-----Original Message-----
From: Jack Olson [mailto:[log in to unmask]]
Sent: Thursday, August 09, 2012 4:35 PM
To: [log in to unmask]; Mike Fenner
Cc: Jack Olson
Subject: Re: pin in paste

I don't think anyone mentioned it,
(and I'm not sure how "real-world" useful it is) but Bob Willis offers a FREE introductory tutorial on Pin-In-Hole-Reflow published by 007
here:

http://pihrtechnology.com/

Jack

.
On Wed, 8 Aug 2012 08:24:20 +0100, Mike Fenner <[log in to unmask]> wrote:

>HI Joyce
>There is plenty of useful stuff available, if you search (including on 
>the usual suppliers' websites) for 'pin in paste' or 'Pin in hole 
>reflow' or 'Intrusive reflow' you will catch a number of pragmatic and 
>some
theoretical
>studies.
>It is possible to not to have drips, push through etc of paste and 
>solder void free with good hole fill.
>What you can do depends on the connector/board design, but generally 
>you
are
>looking to offset the paste on printing rather than print into the 
>hole. On reflow it will wet in. If you need to augment the solder 
>volume because there isn't enough space on board area then you may be 
>able to use
component
>shaped preforms in tape and reel presentation. Just P&P in to the paste 
>as if a component. This is relatively standard presentation for a 
>number of apps not just PIP, so is relatively inexpensive. You can P&P 
>washers in the same way with appropriate tooling although at lower 
>volumes this can be expensive if you need an exotic size in low volumes, due to taping costs.
At
>lower volumes still you can use daisy chains.
>
>
>
>Regards
>
>
>Mike Fenner
>
>Bonding Services & Products
>M: +44 [0] 7810 526 317
>T: +44 [0] 1865 522 663
>E: [log in to unmask]
>
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
>Sent: Tuesday, August 07, 2012 10:04 PM
>To: [log in to unmask]
>Subject: [TN] pin in paste
>
>Joyce Koo
>Materials Researcher - Materials Interconnect Lab Research In Motion 
>Limited
>Office: (519) 888-7465 79945
>Mobile: (226) 220-4760
>
>Hi, Calling on all of the gurus, Anyone has one or two good reference 
>regarding voiding minimization or voiding elimination for pin in paste?
>Hopefully it is not in need of using performs.  Many thanks for all 
>your help.
>Best regards,
>            joyce





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