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August 2012

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Subject:
From:
John Maxwell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Maxwell <[log in to unmask]>
Date:
Thu, 9 Aug 2012 14:03:11 -0700
Content-Type:
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When I was consulting it would be a great source of revenue due to cracking:-)

John

Sent from my iPad

On Aug 9, 2012, at 1:18 PM, Joe Macko <[log in to unmask]> wrote:

> All,
> 
> 
> 
> A question came up about IPC-A-610 acceptability and the feasibility of
> soldering a short piece of 32 awg jumper wire to the "top" of a 0402
> chip capacitor due to space limitations that I would like to hear input
> on and the technical risks. Normally, such jumper wires are positioned
> parallel to the longest dimension of the solder land and soldered as
> recommended by IPC but in this  case there is very limited space so it
> is proposed that the wire be soldered on "top" of the component.
> 
> 
> 
> IPC-A-610E, 8.6.1.1 Jumper Wires, SMT - Chip and Cylindrical End Cap
> Components states that that this is a " Defect - Class 1, 2, 3: Wire
> soldered on top of chip component termination".
> 
> 
> 
> I look forward to hearing back from the hands-on experts.  thx
> 
> 
> 
> Regards,
> 
> -Joe
> 
> 
> 
> 
> 
> 
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