HI Joyce
There is plenty of useful stuff available, if you search (including on the
usual suppliers' websites) for 'pin in paste' or 'Pin in hole reflow' or
'Intrusive reflow' you will catch a number of pragmatic and some theoretical
studies.
It is possible to not to have drips, push through etc of paste and solder
void free with good hole fill.
What you can do depends on the connector/board design, but generally you are
looking to offset the paste on printing rather than print into the hole. On
reflow it will wet in. If you need to augment the solder volume because
there isn't enough space on board area then you may be able to use component
shaped preforms in tape and reel presentation. Just P&P in to the paste as
if a component. This is relatively standard presentation for a number of
apps not just PIP, so is relatively inexpensive. You can P&P washers in the
same way with appropriate tooling although at lower volumes this can be
expensive if you need an exotic size in low volumes, due to taping costs. At
lower volumes still you can use daisy chains.



Regards


Mike Fenner

Bonding Services & Products
M: +44 [0] 7810 526 317
T: +44 [0] 1865 522 663
E: [log in to unmask]

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 07, 2012 10:04 PM
To: [log in to unmask]
Subject: [TN] pin in paste

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760

Hi, Calling on all of the gurus, Anyone has one or two good reference
regarding voiding minimization or voiding elimination for pin in paste?
Hopefully it is not in need of using performs.  Many thanks for all your
help. 
Best regards,
            joyce

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