I used to do a lot of pin in paste on connectors but it has been long
enough that I cannot remember if I eliminated the voiding completely or
not. My memory says that I achieved the 75% and did not have
unacceptable voiding. I remember the worst part of PIP was the dragout
problem of inserting the pins through the solder paste and dripping on
the placement equipment. Don't have an documents to refer you to
offhand. Dean's honeycomb pre-forms sounds like a proven method albeit
more costly.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, August 07, 2012 2:16 PM
To: [log in to unmask]
Subject: Re: [TN] pin in paste
Hi, Joyce.
Sorry, I tried different methods using paste and different brands of
paste (including pre-drying) on connector pins but could not escape the
voids entirely. Pre-drying the paste after insertion/before reflow did
reduce the voiding, but was not practical from an assembly standpoint. I
ended up using honeycomb (daisychain) pre-forms, with absolutely no
voiding but a few minutes of added assembly time. If anyone else has
ideas, I also would like to hear about them.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 07, 2012 4:04 PM
To: [log in to unmask]
Subject: [TN] pin in paste
Joyce Koo
Materials Researcher - Materials Interconnect Lab Research In Motion
Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
Hi, Calling on all of the gurus, Anyone has one or two good reference
regarding voiding minimization or voiding elimination for pin in paste?
Hopefully it is not in need of using performs. Many thanks for all your
help.
Best regards,
joyce
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