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Date: | Thu, 16 Aug 2012 11:31:46 -0400 |
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What type of paste are you using? We are processing a bga 1x.8 with a .5 pitch and .175 ball diameter. We are using a Kester lead free EM828 solder paste. We have the stencil
Apertures cut square encompassing the round pad. This allows for slightly more paste.
Hope this helps,
Brien
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane (Asteelflash,US)
Sent: Thursday, August 16, 2012 9:34 AM
To: [log in to unmask]
Subject: [TN] CSP BGAs
Dear Technetters,
We are going to be assembling some lead-free 1.6x0.8 mm micro BGAs with 0.5mm pitch and 0.17mm dia board pads. Anybody else have experience with this small a package?....I am concerned that there won't be sufficient flux in the tiny solder deposit to clean the oxides during reflow, leading to graping and/or head in pillow situation. Do I need a dip fluxer for the part to do a flux only attachment, or to augment the amount of flux in the solderpaste-solder bump system? I am told I have no time to do DOEs to determine stencil and reflow parameters, so I am turning to technet for help.....any thoughts?
Regards,
Amol
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