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August 2012

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Subject:
From:
"Amol Kane (Asteelflash,US)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Amol Kane (Asteelflash,US)
Date:
Thu, 16 Aug 2012 06:33:38 -0700
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Dear Technetters,

We are going to be assembling some lead-free  1.6x0.8 mm micro BGAs with
0.5mm pitch and 0.17mm dia board pads. Anybody else have experience with
this small a package?....I am concerned that there won't be sufficient
flux in the tiny solder deposit to clean the oxides during reflow,
leading to graping and/or head in pillow situation. Do I need a dip
fluxer for the part to do a flux only attachment, or to augment the
amount of flux in the solderpaste-solder bump system? I am told I have
no time to do DOEs to determine stencil and reflow parameters, so I am
turning to technet for help.....any thoughts?

 

 

Regards,

Amol

 


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