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| Date: | Wed, 15 Aug 2012 19:44:04 +0000 |
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Graham,
OK, we'll consider you a dip until proven otherwise. I hope you are talking about SMT components? There is a good case for not pre-tinning (sounds more technical than dip) PTH parts where there is a reasonable expectation of disillusionment of the gold in your flow solder process.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Wednesday, August 15, 2012 12:16 PM
To: [log in to unmask]
Subject: [TN] gold removal question - to remove or not?
Hello Technet
I'm in the midst of a debate about gold removal. Our policy on component leads is to double dip tin all gold. J-STD-001 says I do not have to do it if there is less than "2.54 ìm [100 ìin]" of gold, but is it realistic to operate on that basis? For example, looking at an Airborne brand connector I find the spec sheet says that there will be 50 ìin gold, minimum. Which is not totally helpful as it does not tell me maximum. I'm assuming given the price of gold that they aren't looking to put a lot more than the minimum on, but how controllable is the process? Could we check the thickness once and assume we are safe?
(and as you can tell from my phrasing I'm of the more conservative camp on this one, still dipping the parts until proven wrong)
regards,
Graham Collins
Halifax Production Engineering
(902) 873-2000 ext. 6215
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