The delaminations are very visible as "bubbles" inside the board.  It is beginning to look like the issue is contained to one particular batch of new boards and it was noticed after reflow.  We are contacting the board house.

-----Original Message-----
From: Paul Reid [mailto:[log in to unmask]] 
Sent: Wednesday, August 15, 2012 1:55 PM
To: TechNet E-Mail Forum; Phil Nutting
Subject: RE: [TN] bare board pre-bake parameters

I always have to warn those who bake to get rid of delamination that it rarely works. The delamination will probably still be with you after the bake. 

How do you know that you have delamination? Is it visible?


Sincerely,  

 

Paul Reid 

Program Coordinator  

PWB Interconnect Solutions Inc. 
235 Stafford Rd., West, Unit 103
Nepean, Ontario Canada, K2H 9C1 

613 596 4244 ext. 229  

Skype paul_reid_pwb
[log in to unmask] 

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: August 15, 2012 10:40 AM
To: [log in to unmask]
Subject: [TN] bare board pre-bake parameters

Good morning all,

We have recently had some boards delaminate and are considering pre-baking as a possible solution.  I need to know some "rules of thumb"
for pre-bake time and temperature, suggested atmosphere (dry nitrogen?), allowable time between pre-bake and soldering.

At the moment I only have minimal information on the boards so I don't know their physical size, number of layers or if they are SMT or PTH.

I realize it could be a bad batch and the problem may only be with one group of boards as this is not a common problem with boards form many of our fab houses or CMs.

Thanks in advance,

Phil Nutting
Design for Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
Phone: 978-922-9300 x1310
Fax: 978-922-8374
e-mail: [log in to unmask]<mailto:[log in to unmask]>
www.kaisersystems.com<http://www.kaisersystems.com>
www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting>


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