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August 2012

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Subject:
From:
"Kuczynski, Michael (H USA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kuczynski, Michael (H USA)
Date:
Wed, 15 Aug 2012 11:47:19 -0400
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Thank You ALL for your excellent suggestions. I've forwarded the suggestions to the AE driving this. We just havn't run into anything like this before and didn't have a logical direction on what to follow next.

We have sent 2 used pcbs (one good [vendor A], one bad [vendor B]) and one unused [vendor A] out for full FA.

They'll be inspecting, probing, measuring, washing and 3D xray glossy pictures [with circles and arrows & a paragraph on back of each one, depicting the scene of the crime :)  ]


We're leaning towards inadequate washing, (Indium solder paste) and cookie-cutter oven profile.  I'll share the results once it's all been finalized.


SIEMENS
Michael Kuczynski       Healthcare Diagnostics Inc.
Product Eng. II CID     511 Benedict Ave.
914-524-3118 (Ph)       Tarrytown, NY 10591
914-524-3322 (Fax)      Mail Stop P25-1-C
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