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August 2012

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Subject:
Die attach and wire bond test kit
From:
"Ahmad, Syed" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ahmad, Syed
Date:
Wed, 15 Aug 2012 08:11:32 -0700
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Does anyone know of a source for a die attach and wire bond (Au wire to Al pads) test kit?
Thanks.
Syed Sajid Ahmad
Center for Nanoscale Science and Engineering (CNSE)
NORTH DAKOTA STATE UNIVERSITY
Phone 701 231 5880
www.ndsu.edu/cnse<http://www.ndsu.edu/cnse>
[cid:[log in to unmask]]



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