Wow. Sweet.  Many thanks.  

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Thursday, August 09, 2012 11:35 AM
To: [log in to unmask]
Subject: Re: [TN] pin in paste

I don't think anyone mentioned it,
(and I'm not sure how "real-world" useful it is)
but Bob Willis offers a FREE introductory tutorial 
on Pin-In-Hole-Reflow published by 007 
here:

http://pihrtechnology.com/

Jack

.
On Wed, 8 Aug 2012 08:24:20 +0100, Mike Fenner <[log in to unmask]> wrote:

>HI Joyce
>There is plenty of useful stuff available, if you search (including on the
>usual suppliers' websites) for 'pin in paste' or 'Pin in hole reflow' or
>'Intrusive reflow' you will catch a number of pragmatic and some theoretical
>studies.
>It is possible to not to have drips, push through etc of paste and solder
>void free with good hole fill.
>What you can do depends on the connector/board design, but generally you are
>looking to offset the paste on printing rather than print into the hole. On
>reflow it will wet in. If you need to augment the solder volume because
>there isn't enough space on board area then you may be able to use component
>shaped preforms in tape and reel presentation. Just P&P in to the paste as
>if a component. This is relatively standard presentation for a number of
>apps not just PIP, so is relatively inexpensive. You can P&P washers in the
>same way with appropriate tooling although at lower volumes this can be
>expensive if you need an exotic size in low volumes, due to taping costs. At
>lower volumes still you can use daisy chains.
>
>
>
>Regards
>
>
>Mike Fenner
>
>Bonding Services & Products
>M: +44 [0] 7810 526 317
>T: +44 [0] 1865 522 663
>E: [log in to unmask]
>
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
>Sent: Tuesday, August 07, 2012 10:04 PM
>To: [log in to unmask]
>Subject: [TN] pin in paste
>
>Joyce Koo
>Materials Researcher - Materials Interconnect Lab
>Research In Motion Limited
>Office: (519) 888-7465 79945
>Mobile: (226) 220-4760
>
>Hi, Calling on all of the gurus, Anyone has one or two good reference
>regarding voiding minimization or voiding elimination for pin in paste?
>Hopefully it is not in need of using performs.  Many thanks for all your
>help.
>Best regards,
>            joyce

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