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| Reply To: | New release announcements of IPC documents (all languages) |
| Date: | Wed, 1 Aug 2012 15:49:38 +0000 |
| Content-Type: | multipart/mixed |
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HDBK-850
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=eb8246cf-33db-e111-9680-00155d05286a>
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in developing this handbook is that there has been no clear industry definition that distinguished between potting and encapsulation. From glob-top to dam-and-fill, this document uses terminology associated with processes related only to electronic printed circuit board assembly and protection. Understanding and accounting for these materials can ensure the reliability and function of electronics. 68 pages. Released July 2012.
Member Price: $50.00
Industry Price: $100.00
IPC members may request a free single user download of this document with digital rights management of each new standard by e-mailing [log in to unmask]<mailto:[log in to unmask]> within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.
Kimberly Sterling, CAE
Chief Marketing Officer
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2805 tel
+1 847-615-5605 fax
[log in to unmask]
www.ipc.org
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