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July 2012

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Fri, 13 Jul 2012 08:41:06 -0700
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Craig,

The fact that the voids are there wouldn't concern me as much as why...

Some of these pictures appear to show embedded volatile material and Cu in the voiding areas...

If the PCA was going to go through extreme thermal cycling I might be concerned about growth of shear cracks around the voiding areas (j4pin3-4)...

But J4pin3-4 looks like you are over a reasonable voiding limit because of the amount of unattached pin surface not in contact with the solder...

Paul

Paul Edwards
Process/Quality Engineering
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Friday, July 13, 2012 5:53 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

Hi Everyone, 

I am resurrecting this thread to add some section pictures. 
They can be viewed here: http://ipc-technet.groupsite.com/galleries/show/23706.

I agree some of the larger voids might be cause for concern, but they were not soldered using a hot plate/pre-heater. Most of the pictures show an end result of pre-heating the PCB on a hot plate to a top board temp of 100 °C prior to soldering. Now my dilemma is, I have to convince the customer that some voiding is normal and will intrinsically occur no matter what. They are pushing back and requesting 0% voiding. 

Any thoughts?
Craig 







Subject:
		

Re: Through hole barrel voids

From:
		

Craig Sullivan <[log in to unmask]>

Reply-To:
		

TechNet E-Mail Forum <[log in to unmask]>, Craig Sullivan <[log in to unmask]>

Date:
		

Wed, 16 May 2012 15:22:10 -0400

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Reply 		

Reply

Thank you for all of the answers. The connector in question is a d-sub type and only accessible with an iron from one side. I am waiting for section results/pictures. As one colleague pointed out, the voids seem to concentrate on the solder side of the board. Boards are baked and removed from the oven one at a time as they are hand soldered. These do not see a wave/selective cycle. I am in the process of setting up the hot plate to run a few more tests. Surface finish is ImAg and the process is SnPb. The connector leads are pre-tinned (SnPb) so sayeth the datasheet. As for the answers regarding the poor barrel plating I am also sectioning these, but as I mentioned before, initial solderability was fine.

Thank you again,
Craig Sullivan
Manufacturing Engineer
MPL Incorporated
P: 607.266.0480
F: 607.266.0482
[log in to unmask]
 Please consider the environment before printing this e-mail.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Wednesday, May 16, 2012 2:28 PM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

Let me state the obvious even though I did not see it mentioned.....it is possible to double side hand solder and trap large voids in the barrel.....I know because I have seen an engineer attempt this.  In his mind, the solder joints looked great and visually it was compliant.....but I advised him that the procedure was not authorized and proceeded to xray the connection and show him the error in his ways.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, May 16, 2012 10:45 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

To reject, or not to reject, that is the question:
Whether 'tis Nobler in the mind to suffer The Slings and Arrows of unfortunate outgassing, Or to take X-rays against a Sea of voids, And by opposing accept them: to die, to pry No more; and say we end the heart-ache, and the thousand thermal shocks That the assembly is heir to? 'Tis a consummation Devoutly to be wished for those who don't have a bodkin against their chest to honor the bottom line.

Barring the chance that I have missed the connection and this was a metaphorical response to voids or unfulfilled expectations in life and not the printed board assembly: all other things being equal; I would accept them (the PTH voids) as-is.

Dewey    

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eva J
Sent: Wednesday, May 16, 2012 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

Craig,
Was this PCB/ connector subjected to wave solder, hand solder and or intrusive pin/paste solder process?
I have seen touch up soldering to " fill the barrel" on the component side create voids and contaminant entrapment which may be a reliability issue.
What is the cumulative fill? Solder fill provides the mechanical strength to withstand its service environment.
Eva
Spec Tech
On Wed, May 16, 2012 at 9:12 AM, David D. Hillman < [log in to unmask]> wrote:

> Hi Craig! One of the downsides of now having access to Xray inspection

> technology is that we can see many "things" we never could before - 
> which now causes the question "is that bad?". There is currently no 
> plated thru hole void criteria in the IPC JSTD 001 specification. I 
> would recommend that an assessment of  the assembly be initiated.
> Pulling and inspecting a number of assemblies that either have been in

> the field or have passed all of the qualification tests will 
> demonstrate what level of voids typically exist and if that level of 
> voiding is a reliability issue. The presence of voids is not
necessarily an indication of a reliability issue. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
> Craig Sullivan <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/16/2012 07:14 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Craig 
> Sullivan  <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> [TN] Through hole barrel voids
>
>
>
>
>
>
> Hi everyone,
>
>
>
> We have a certain board with several through hole connectors. The 
> customer has provided us x ray images showing voiding in the barrels.
> Fillets on both sides are acceptable, and the solderability tests are 
> ok. This seems to be isolated to this board because random sampling on

> other boards shows virtually no voiding. The only voiding "criteria" I

> can find is related to BGAs. Is there any published criteria / 
> reference material for this type of defect?
>
>
>
> Thank you,
>
> Craig Sullivan
>
> Manufacturing Engineer
>
> MPL Incorporated
>
> P: 607.266.0480
>
> F: 607.266.0482
>
>  <mailto:[log in to unmask]> [log in to unmask]
>
> P Please consider the environment before printing this e-mail.
>
>
>
>
>
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