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July 2012

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 5 Jul 2012 18:10:45 +0300
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Agreed, Dave. Identification of the cause is always a good place to start.

Brian

On 05/07/2012 17:24, David D. Hillman wrote:
> Hi Neil - before you go down that road, I recommend you determine the root
> cause of the dendritic growth. You may be able to eliminate the issue with
> other methods than tenting the vias which may be more advantageous or
> lower cost.  Tenting the vias could make the situation worst depending on
> what is causing their initiation and growth. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Neil Atkinson <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 07/04/2012 11:02 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> [TN] Copper Dendrites
>
>
>
>
>
>
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>
>   What is the view of covering vias with solder resist to prevent dendrite
> growth?
>
> This is an FR4 PCB with OSP finish, SMT reflow both sides and a few
> through hole components soldered with a selective soldering process...
>
> Thanks in anticipation of the help of the Technet!
>
> Neil
>
>
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