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July 2012

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Tue, 17 Jul 2012 10:08:46 -0400
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Stephen,

To coin a well used phrase, "It all depends".

Most die bonders have the capability to check for ink dots since they have
to visually determine just where the die is anyway.  Many/most also have the
capability to work from down-loaded wafer maps from the probe and test
operation.

It depends on what equipment you have...

Best regards.

Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Ayotte
Sent: Tuesday, July 17, 2012 9:38 AM
To: [log in to unmask]
Subject: [TN] Module Build, Wafer picking capability

I am not sure who on the distribution performs module assembly but I have a
question for those who do.

Is your die picking tool capable of seeing a die with an ink dot indicating
the die is not to be picked.

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM
Internet id: [log in to unmask]
Phone:  802 769 4775


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