Hi Juliano,

The voids are also very dependant to solder paste and component. Testing other materials can be a solution. 
If the pad surface is important it is geneally recommended to split the solder deposite in individual deposites (multiscares...). Some add solder mask cross in middle of their large pad to create outgassing chanel during reflow.
Profile can also impact. The general idea is then to increase time and/or temperature in the acceptable limits to outgassing as much as possible and decrease the voids.

My 2 cents
Grandrien.


========================================
Message du 13/07/12 23:06
De : "Juliano Ribeiro" 
A : [log in to unmask]
Copie à : 
Objet : [TN] SMD Component VOID

Hello all

We have some voiding in my solder.
Can I do to reduce void in my solder? My component is SMD. How I change my profile to reduce void in my solder?

Thank you

Juliano Ribeiro




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