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Date: | Tue, 24 Jul 2012 08:30:25 -0700 |
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Hi Doug,
Thanks for your response. I will look up the information about SPF.
Regards
Ravinder Ajmani
Principal HW Engineer, Signal Integrity / EMI
HGST, a Western Digital company
[log in to unmask]
Phone: 408-717-7956
5601 Great Oaks Pkwy.
San Jose, CA 95119-1003
www.hgst.com
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07/24/2012 08:15 AM
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Subject
Re: [TN] Alternative to Solder Mask for high-speed interconnects
Ravinder,
You might consider a material from Semblant called SPF. It is a material
that is vapor deposited and was originally developed as a board surface
finish. It works well against harsh environments and has the "potential"
for replacing solder mask in sensitive RF applications. The stuff only
goes on about 40 nm thick. Hillman and I did an evaluation of this
material as a board surface finish a few years back and Semblant has our
report, which is available. Read through it all as the material has a few
"quirks". We evaluated the material between 1 and 9 Ghz and found no
significant effect on signal integrity.
Semblant has offices in Chandler, Arizona. 480.722.1419
Doug Pauls
From: <[log in to unmask]>
To: <[log in to unmask]>
Date: 07/23/2012 06:21 PM
Subject: [TN] Alternative to Solder Mask for high-speed
interconnects
Sent by: TechNet <[log in to unmask]>
Hi Experts,
I am looking at the alternatives to Solder Mask for surface high-speed
interconnects, as solder mask causes impedance discontinuity. I would
like to use OSP process instead of solder mask, but I have been told that
OSP does not protect Copper in harsh environment. I will appreciate if
you can suggest some other alternatives.
Thanks.
Regards
Ravinder Ajmani
HGST, a Western Digital company
[log in to unmask]
5601 Great Oaks Pkwy.
San Jose, CA 95119-1003
www.hgst.com
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