You didn't give your X and y, but assuming "normal" size, VPR is a good
candidate process for heavy thermal work loads. 
Post reflow handling/cool down will need some attention whatever your
process, as your work will represent a significant thermal reservoir. 
[Most systems concentrate on getting a good up profile and then they're
pretty well done.]


Regards


Mike 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Monday, July 23, 2012 7:42 PM
To: [log in to unmask]
Subject: [TN] 10 oz Cu PCB Assys

Hello Fellow TechNetters:

Can anyone share some information on processing SMD's on PCB's that have 10
oz. of Cu?

Difficulties in processing, lessons learned, etc.

Thank you all in advance,
Bill



 

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